| 摘要 |
In an integrated circuit package, the central "paddle" of the lead frame on which the semiconductor chip (17) is mounted comprises two separate, electrically isolated portions (10, 11) which extend beyond edges of the chip and which is each electrically connected to a different terminal pin of the package. External power is applied to these two chip support portions by means of which electrical power can be distributed to numerous areas (as desired) on the chip via bonding wires (23, 24) extending between the chip areas and the paddle portions. |
