| 摘要 |
<p>PURPOSE:To eliminate the stripping of elements or the generation of cracks by a method wherein the frame area of an element-mounting part is set at 20-60% of the element area, where the following element is then fixed with polyimide series paste or solder, when a large-scaled semiconductor element having a side over approx. 6mm. is fixed to the element-mounting part of a copper series lead frame. CONSTITUTION:On the semiconductor element mounting part of the lead frame 22 approx. 0.25-0.4mm. thick, the plane and square semiconductor element 21 is fixed by the use of an adhesive 23, while the centers thereof are adjusted. In this construction, if the element 21 is a large-scaled element having a side over approx. 6mm., its area at the mounting part of the frame 22 is reduced to 20-50% of the element area. Besides, the adhesive 23 composed of polyimide series paste of large adhesion strength or solder is used for fixing the element 21 to the frame 22. Such a manner makes it sufficient that contraction stress is small, even when it acts on the element 21 in the cooling process at the time of fixing, and cracks and the like do not generate in the element 21.</p> |
