发明名称 WRITABLE INTEGRATED CIRCUIT PACKAGE
摘要 <p>PURPOSE:To improve the efficiency of various works by enabling to described an identifying circuit for various circuits readly by a writing instrument used normally on the surface of an IC package. CONSTITUTION:A pale sheet of suitable area or rough surface plastic sheet is bounded at the prescribed position on the surface of an IC package. Thus, prescribed symbols can be described by a pencil on this portion, thereby largely improving the efficiency of various works such as maintenance or tests.</p>
申请公布号 JPS6066835(A) 申请公布日期 1985.04.17
申请号 JP19830175846 申请日期 1983.09.22
申请人 TOUYOU TSUUSHINKI KK 发明人 ANDOU ICHIROU
分类号 H01L23/00;H01L23/544 主分类号 H01L23/00
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