| 摘要 |
PURPOSE:To effectively dissipate heat generated in a semiconductor element to the outside by fixing a semiconductor element on a section of a lead frame which is formed to have a large thickness and by resin sealing the semiconductor element and the lead ends opposed thereto. CONSTITUTION:In a lead frame consisting of a semiconductor element carrying section 11 and a plurality of leads 14 surrounding the same, the section 11 for carrying a semiconductor element 12 is formed to be much thicker than other sections. A semiconductor element 12 is fixed on the carrying section 11, and the electrode wirings provided therein are connected to the leads 12 opposed to the element with the use of lead lines 13. Thereafter, the element 12 and the ends of the leads 14 are sealed with resin 15 while the rear face of the carrying section is exposed to the air, and the portions of the leads 14 appearing outside of the sealed device are bent as required. In such a manner, heat generated in the semiconductor 12 can be dissipated from the carrying section directly to the outside of the device. |
