| 摘要 |
PURPOSE:To shorten wiring length by first and second wiring layers, which are arranged orthogonally while each having a plurality of wirings, and third wiring layers obliquely tying the intersecting points of these wiring layers. CONSTITUTION:First wiring layers 11 consisting of a plurality of wirings extending in the first direction are formed on a semiconductor substrate 20 while second wiring layers 12 composed of a plurality of wirings extending in the direction orthogonal to the first direction are shaped on the first wiring layers 11 through an insulating film. On the other hand, third wiring layers 13 are formed on the wiring layers 12 through an insulating layer. The third wiring layers 13 are formed in the oblique direction that the intersecting points of the first and second wiring layers 11, 12 are tied. Accordingly, wiring length connecting each semiconductor element can be shortened. An automatic wiring program by an automatic design system can be prepared easily because the intersecting points of each layer wiring are aligned at the same interval. |
