| 摘要 |
PURPOSE:To position both surfaces of a wafer with high accuracy without damaging the wafer by exposing the wafer while being bonded with a glass plate during the exposure of the wafer by a normal exposure machine. CONSTITUTION:A positioning reference pattern 4 is formed to the surface 3a of a wafer 3. The surface 3b of the wafer 3 is bonded with a glass plate 2 on which a photo-resist 2 is applied, and exposed in conformity with the pattern 4, thus forming a second reference pattern on a glass plate 1. A glass plate 5 on which a different kind of a photo-resist 6, which does not dissolve into a solvent for the resist 2, is applied is bonded with the surface 3a, the resist 6 is exposed while using the second reference resist pattern as a photo-mask, and the pattern is transferred, thus forming a third reference resist pattern. The glass plate 1 on the surface 3b of the wafer 3 is peeled, a photo-resist 7, a solvent therefor differs from that for the resist 6, is applied on the surface 3b, and the third reference resist pattern formed on the glass plate 5 is positioned and the surface 3b is positioned and exposed. |
