| 摘要 |
<p>An infrared radiation detector in which a stable substrate has a hole through it and a pair of bonding pads on two opposite sides of the hole, the hole being covered by a pellicle of insulating or semi-conductor material with supports over the hole, a detector element comprising an ultrathin infrared absorbing film of nickel, palladium, platinum or iridium less than 10 nm thick or a gold film less than 20 nm thick, two sides of the detector element connecting to the bonding pads by thin film contacts.</p> |
