| 摘要 |
PURPOSE:To enable fine circuit patterns to be formed, by removing the corner sections from the patterns with electrolytic polishing, and by plating the patterns electrolytically, after the circuit patterns are formed by means of etching. CONSTITUTION:First, on the both surfaces of an insulating layer 1, flexible substrates with formed copper foil layers 2A, 2B are arranged. Second, after the layers are patterned with photoresists 3A, 3B, the layers are treated by means of etching to remove unnecessary sections and to form coil patterns 4A, 4B. Third, after the photoresists 3A, 3B are exfoliated, roundish patterns are obtained by removing the corner sections from the coil patterns 4A, 4B, namely, the shoulder sections of the pattern edges by means of electrolytic polishing. After that, a penetrating slot 5 for a through hole as part of the patterns is formed. Finally, the patterns are electrolytically plated, and coil patterns 6A, 6B are obtained by separating out copper on the surface of the coil patterns 4A, 4B. |
