THERMOSETTING ADHESIVE COMPOSITION INCLUDING EPOXY RESIN AND HALF ESTER PRODUCT OF SAPONIFIED ETHYLENE/ VINYL ACETATE COPOLYMER WITH A DICARBOXYLIC ACID

摘要

A thermosetting adhesive composition is disclosed which contains (a) a half-ester product of a saponified ethylene/vinyl ester copolymer with a dicarboxylic acid and (b) a solid or liquid epoxy resin, and this composition may further optionally contain a compound bearing two or more carboxyl groups. The composition is useful as a structural adhesive and has a good storage stability and good solubility in solvents. It can be cured at relatively low temperatures in a shortened time. After curing, the composition shows good heat-resistance and has good adhesive properties.