发明名称 MOUNTING METHOD OF ELECTRODE TO LEADLESS DIODE
摘要 PURPOSE:To mount upper side electrodes easily at the upper ends of glass tubes by preventing the loss of the upper side electrodes from a jig even on a separation from the jig of a vacuum chuck and visualizing the upper side electrodes in each recessed section of the jig when the upper side electrodes are fitted at the upper ends of the glass tubes. CONSTITUTION:A diode chip 3 is fitted at the upper end of the shaft of a lower side electrode 2, and the shaft section is inserted into the lower end of a glass tube 4, thus manufacturing a semimanufacture 1'. The semimanufacture 1' is received in the recessed section 6 of a jig 5, a guide 14 is placed, a vacuum chuck 9 is superposed as an upper side electrode 7 is left as it is sucked, the recessed section 10 of the chuck and the hole 15 of the guide are positioned to the recessed section 6 of the jig, the vacuum of the chuck is broken and the electrode 7 is dropped, and the chuck is detached from the upper surface of the guide. The upper surfaces of the guides are exposed, the electrodes 7 are all inserted into each hole 15 and do not roll out of the guides 14, the electrodes 7 sink up to the lower sides of the holes, inclined upper side electrodes are fitted to the glass tubes 4 when they are shaken together with the jig 5 or the head sections of the upper side electrodes are vibrated by a bar, all the upper side electrodes are visualized, and workability is improved.
申请公布号 JPS6047449(A) 申请公布日期 1985.03.14
申请号 JP19830156674 申请日期 1983.08.26
申请人 ROOMU KK 发明人 ITANI SHIGERU;SURUGA MICHIYASU
分类号 H01L23/48;H01L21/50 主分类号 H01L23/48
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