发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To make a junction pad and a pin for a case correspond distinctly on a junction while preventing the increase of the area of a chip by forming a stepped section representing a symbol onto the surface of the junction pad. CONSTITUTION:Stepped sections representing symbols, such as N-, N, 1... are formed onto the surface of a junction pad 12 for a semiconductor chip 11. A region representing a figure 1 is formed by the stepped section in several hundred Angstrom by utilizing an SiO2 film 17 generated when a P<+> layer 16 is shaped on an N epitaxial layer 15 on a P type Si substrate 14, and Al 18 is evaporated, thus obtaining a junction pad with the stepped section representing the figure 1. Since the necessary symbols are displayed on the pad, the symbols are made sure easily on the analysis of the inside of the chip and the inside of the chip can be analyzed efficiently, the correspondence of the pad and pins for a case is decided excellently and a defective connection can be prevented, and the area of the chip can be reduced by putting a symbol consisting of Al near a conventional pad.</p>
申请公布号 JPS6047451(A) 申请公布日期 1985.03.14
申请号 JP19830156084 申请日期 1983.08.26
申请人 NIPPON DENKI KK 发明人 TSUNEKAWA YASUMASA
分类号 H01L21/60;H01L23/544 主分类号 H01L21/60
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