| 摘要 |
PURPOSE:To perform clean working with which no projecting parts are formed on a working surface in the stage of working a substrate with a laser beam by applying the laser beam to the substrate in the state of immersing the substrate in water or other liquid. CONSTITUTION:A semiconductor substrate 6 is immersed in pure water 5 in a vessel 4 and in this state a laser beam is applied thereto by a laser gun 7, by which the substrate is subjected to necessary working. The substrate material scattering by melting is thus quickly cooled by the surrounding water and is prevented from sticking to the substrate 6. |
