| 发明名称 |
Electroless copper plating solution. |
| 摘要 |
<p>An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or a,a'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.</p> |
| 申请公布号 |
EP0133800(A1) |
申请公布日期 |
1985.03.06 |
| 申请号 |
EP19840305269 |
申请日期 |
1984.08.02 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
NAKASO, AKISHI;OKAMURA, TOSHIRO;YAMANOI, KIYOSHI;NAKAJIMA, SUMIKO |
| 分类号 |
C23C18/40;(IPC1-7):C23C18/40 |
主分类号 |
C23C18/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
