| 摘要 |
Circuits carrying discrete chips are soldered by creating a wave in molten solder which has its main dimension obliquely w.r.t. the general alignment of the chip front faces and/or is subjected to an orbital or alternating movement along its main dimension. The general alignment of the chip front faces is pref. perpendicular to the circuits feed direction and the wave main dimension oblique w.r.t. the feed direction, or vice versa. The appts. pref. has a well to hold the melt, and the wave is produced by a slot-shaped nozzle formed in the well lid and movable to produce the required angle or movement. The lid is pref. slidable perpendicularly to the feed direction or parallel to the slot main dimension. |
