发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To improve the absolute accuracy of a resistor and temperature characteristic and to reduce the size by printing a thin film conductive paste on a substrate, baking it and then forming a film to be partly superposed with a thick film conductor pattern on the thin film for a resistor. CONSTITUTION:A silver-palladium paste is printed on an aluminum substrate 1, and baked to form a thick film conductor pattern 2. An oxygen-doped nitrided tantalum film 3 is formed on the entire surface of a structure. The film 3 is etched with a mixture solution of hydrofluoric acid, nitric acid and acetic acid so as to become part of a thick film conductor by photolithographic technique, the resistor is stabilized and heat treated, and cut at the part 4 by a laser trimming method, thereby obtaining a desired resistance value.</p>
申请公布号 JPS6041252(A) 申请公布日期 1985.03.04
申请号 JP19830149894 申请日期 1983.08.17
申请人 NIPPON DENKI KK 发明人 HARADA KEIJI
分类号 H01C17/06;H01L27/01;H05K1/16 主分类号 H01C17/06
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