| 摘要 |
PURPOSE:To reflect lighting beams in an optical system in one direction and prevent the spread of reflected beams, and to obviate the slide of a solder bump when a wiring substrate is placed on a connecting terminal by flattening the nose of the solder bump. CONSTITUTION:A flat plate is pushed aginst the upper surfaces of solder bumps 12 under the state in which solder is melted again, and flat sections 14 are formed at the noses of solder bumps. Consequently, when lighting beams 32, 34 from a lighting 30 are projected from sections just under the solder bumps 12 on a positioning between a semiconductor device 10 and a wiring substrate 6, the pictures of the solder bumps 12 are transmitted over a TV camera 46 because the lighting beams are reflected completely to the sections just under the bumps by the flat sections 14, and distinct pictures can be projected to a TV monitor. When the semiconductor device 10 is placed under the state in which it is brought into contact with solder films 9 as the upper surfaces of connecting terminals 8 formed on the surface of the wiring substrate 6, the semiconductor device can be positioned accurately and placed without being slid by the flat sections 14. |
