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发明名称
METHOD OF SEPARATION OF CASINGS FROM GOLD PLATED METAL BUSHINGS OF PACKAGES OF SEMICONDUCTOR DEVICES
摘要
申请公布号
PL132388(B1)
申请公布日期
1985.02.28
申请号
PL19810234407
申请日期
1981.12.23
申请人
发明人
分类号
H01L;H01L23/00;(IPC1-7):H01L23/00
主分类号
H01L
代理机构
代理人
主权项
地址
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