发明名称 RESIN COMPOSITION
摘要 <p>PURPOSE:To decrease weight loss during curing and to improve electrical properties, etc., at high temperatures, by adding xylyl (meth)acrylate and/or xylylene di(meth)acrylate to an unsaturated polyester. CONSTITUTION:The purpose resin composition in prepared by mixing (A) 100pts. wt. unsaturated polyester obtained by using a hydroxylalkyl isocyanurate [e.g., bis(2-hydroxyethyl)isocyanurate] as the alcohol component with (B) 3-200pts.wt. xylyl (meth)acrylate and/or xylylene di(meth)acrylate, and (C) 0-100pts.wt. monomer copolymerizable with components A and B (e.g., diethylene glycol dimethacrylate). The resulting resin composition can be used suitably as an insulating coating for electric appliances and devices, an adhesive resin, or the like.</p>
申请公布号 JPS6035012(A) 申请公布日期 1985.02.22
申请号 JP19830142477 申请日期 1983.08.05
申请人 NIPPON SHOKUBAI KAGAKU KOGYO KK 发明人 TAKIYAMA KEIICHI;TAKAHAMA YOSHIO;FUNDOU MASAAKI
分类号 C08F299/00;C08F283/01;C08F299/04;C08G63/00;C08G63/68;C09D4/00;C09D11/03;C09D11/10;C09D11/101;C09D11/104;C09D11/106 主分类号 C08F299/00
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