发明名称 GRINDING DEVICE FOR OPERATING HOLE
摘要 PURPOSE:To polish a wall surface of a setting groove being situated in an inward peripheral edge of an operating hole in a mechanical manner as well as make the polishing operation performable so easily and in a short time, by attaching a turning device to a peripheral edge part of the operating hole that you want to polish, while operating a polishing device from the outside of the operating hole by means of an operating device. CONSTITUTION:First, a movable fixed member 7 is adjusted for movement so as to make a turning member 8 turnable on a track conformed to the form of an operating hole you want to polish. And, an abrasive part 2b of a polishing device 2 is inserted into the operating hole 10 while a turning device 1 is attached to an outer wall surface in and around the operating hole 10, and it is surely locked thereto by dint of suction attraction of a magnet 4a. And, after the abrasive part 2 is made contact with a setting groove wall surface 11, a large disc 5a is rotated with a handle 3a whereby rust or the like on the setting groove wall surface 11 is easily and surely scraped off, thus it is polishable so as to become a uniform surface.
申请公布号 JPS61270064(A) 申请公布日期 1986.11.29
申请号 JP19850111938 申请日期 1985.05.24
申请人 NIITAKA BUSSAN KK 发明人 YOSHIHARA YUTAKA
分类号 B24B19/08;B23Q9/00;B24B19/12 主分类号 B24B19/08
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