| 摘要 |
PURPOSE:To detect a flaw in an extremely easy manner, by a method wherein the required part of an upper conductor in electronic parts is removed to expose a cloth structural insulating part and, after a water droplet was dripped, DC voltage is applied between upper and lower conductors. CONSTITUTION:The upper conductor 4 in electronic parts such as a thick film hybrid board is removed by a grinding means such as sand blast 10 to expose cloth glass 3 of a lower layer. The whole is immersed in a solder tank 11 and the conductor 4 still remaining is removed in a state caught by solder. Subsequently, a water droplet 13 is dripped on the cloth glass 12 and DC bias voltage is applied between upper and lower conductors 2, 4. Then, by observing the generation of continuous air bubbles 13 or metal migration 14 extending in a dendrite form, flaw detection is performed. By this method, a piercing flaw or the lowering in insulating resistance can be detected by an extremely simple method. |
