| 摘要 |
PURPOSE:To provide titled resist ink which prevents copper deposition of a printed wiring board, is stable and has good printability by consisting the same of an epoxy resin compsn. in which a filler contg. ultrafine particulate silica and asbestos is incorporated at the specific compsn. content in the solid component. CONSTITUTION:Resist ink for electroless plating consists of an epoxy resin compsn. in which a filler contg. at least ultrafine particulate silica and asbestos is incorporated at 7-30wt% in the solid component. Said ink can prevent the copper deposition of a printed wiring board, is stable to a chemical roughening liquid and electroless plating liquid and has good printability. Aluminum silicate, zirconium silicate, barium sulfate, titanium oxide, etc. are incorporated in said filler in addition to the ultrafine particulate silica and asbestos. The printability is good and the growth of copper plating in the stage of electroless copper plating is good when the total amt. of the ultrafine particulate silica and asbestos is in a 5-15% range. The content of the ultrafine particulate silica is preferably in a 1.5-5% range. |
