| 摘要 |
PURPOSE:To increase the mounting density by direct attachment to a printed board by a method wherein the group of electrodes connecting a plurality of semiconductor substrates and element forming surfaces are hermetically sealed from the external space. CONSTITUTION:The element forming surfaces 3a and 3b and the groups of electrodes 2a and 2b are isolated from the external space by hermetic sealing with annular bodies 1a and 1b fixed by bonding to each other. In other words, the surfaces and the groups of electrodes are hermetically sealed and protected sufficiently, and accordingly the mechanical strength is large. Therefore, even without a special package, bonding can be carried out directly to the printed board. Besides, this device has a structure of the double-layer lamination of semiconductor substrates; that is, the mounting density is twice as large as the conventional semiconductor device. Consequently, the integration degree can be increased by miniaturization of this device. |
