发明名称 CONTINUOUS PLATING DEVICE FOR METALLIC HOOP
摘要 PURPOSE:To improve the positional accuracy of a plating layer formed on a metallic hoop with a device for pressing the traveling metallic hoop to the outside circumferential surface of a rotary coating roll dipped in a molten metallic bath by providing a heater for preheating the metallic hoop prior to the treatment. CONSTITUTION:For example, a hoop 11 is let off by pinch rollers 14 to the right and is passed through a solder treating tank 18 in the case of forming a solder layer 12 on the central part in the transverse direction on one surface of the hoop 11. The hoop 11 is pressed to the outside circumferential surface of a coating roll 20 of which the lower part is dipped in molten solder 17 in the tank 18 and which is rotated by a motor 22 to form the solder layer having the width corresponding to the width of the roll 20. A preheater 16 provided with a heater 15 for heating the top and bottom surfaces of the hoop 11 is provided in front of the tank 18. The heating of the hoop 11 to about the same temp. as that of the solder 17 is made possible and the solder layer having good surface appearance, dimensional accuracy of width and adhesion is obtd.
申请公布号 JPS6024361(A) 申请公布日期 1985.02.07
申请号 JP19830130857 申请日期 1983.07.20
申请人 SUMITOMO DENKI KOGYO KK 发明人 TAKANO SATORU;ISHIGURO SHINGO
分类号 B23K1/08;C23C2/00;C23C2/02 主分类号 B23K1/08
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