| 摘要 |
<p>PURPOSE:To reduce noises by miniaturizing and unifying a reflection type photosensor through a double transfer molding method and interrupting a direct optical path between light-emitting and light-receiving element sections. CONSTITUTION:A LED2 and a phototransistor 3 are placed on lead frames 1, and wired 4 and molded primarily with a light-transmitting resin 5. When the whole is molded secondarily and sheathed with a light-transmitting resin 7, a projection 9 is formed simultaneously between the elements 2 and 3 in height higher than light-emitting and light-receiving windows in a primarily molded upper surface. An optical path 8 directly reaching to the light-receiving element side through tapered 6 sections is interrupted by the projection 9, and problems regarding noises can be improved by simple structure.</p> |
