发明名称 MANUFACTURE OF THICK FILM PRINTED SUBSTRATE
摘要 <p>PURPOSE:To enable to perform surely and easily positioning of a laser beam necessitating no screen by a method wherein a series of processes to irradiate solid coated paste by the laser beam to be sintered in the necessary pattern, and to wash away an unirradiated part are repeated for the necessary number of times. CONSTITUTION:A process 1 to apply conductor paste completely on the surface of a substrate, and a process 2 to radiated a laser beam according to the necessary pattern are executed, and dried and sintered. Then by executing a washing process 3 to wash away the conductor paste at the part not irradiated by the laser beam according to a cleaning fluid, a primary intermediate product 4 having the necessary conductor pattern can be obtained. Then, a process 11 to perform solid printing of insulator paste, the radiation process 12 of the laser beam and a washing process 13 are executed, and a secondary intermediate product 14 having a pattern compounded the conductor pattern and an insulator pattern is obtained on the substrate. A prosess 20 to form a resistor pattern on the substrate, and a process 30 to form a protective coating pattern are executed hereafter and after then a trimming process 5 to obtain a proper resistance value in regard to the resistor pattern is executed to obtain the final product.</p>
申请公布号 JPS6020549(A) 申请公布日期 1985.02.01
申请号 JP19830129625 申请日期 1983.07.14
申请人 SUMITOMO DENKI KOGYO KK 发明人 TANAKA MASATOSHI
分类号 H01C17/06;H01L27/01;H05K1/09;H05K3/02 主分类号 H01C17/06
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