发明名称 SOLDER-DIP DEVICE
摘要 PURPOSE:To enable to execute a solder-dip process without necessitating mechanical holding by a method wherein a processing material consisting of a paramagnetic material is conveyed using magnetically attractive force, and immersed in a solder liquid during conveyance thereof. CONSTITUTION:A DHD type diode 1 reaching the outlet of the outlet tube 3 of a parts feeder 2 is magnetically attracted at the prescribed interval on the circumference of a rotating magnetic drum 4, passes in the jet of molten solder 9 in a solder in a solder tank 8 in proportion to the rotation of the magetic drum 4, and electrodes 7a, 7b at both the edges are dipped in solder. The DHD type diode 1 after solder dip thereof is completed comes out from the molten solder in proportion to the rotation of the magnetic drum 4 to be cooled, pulled apart from the magnetic drum 4 according to intensely magnetic force of a magnet 10, and withdrawin in a recovery case 11 due to a magnetic field applied to the magnet 10 or the transfer of the magnet 10.
申请公布号 JPS6020545(A) 申请公布日期 1985.02.01
申请号 JP19830127634 申请日期 1983.07.15
申请人 HITACHI SEISAKUSHO KK 发明人 YAMADA KOUHEI;IKEDA YASUHIKO
分类号 H01L23/48;B23K3/06 主分类号 H01L23/48
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