发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To remove the disconnection of an Al electrode wiring, and to form the electrode wiring having high reliability by adequately sloping the shape of the side surface of a contact window having a large stepped section. CONSTITUTION:A resist pattern 7 for forming a contact window is shaped through a normal photolithography process. First reactive ion etching treatment by a Freon group gas is executed. O2 gas is introduced to an etching chamber, and a resist is removed. Second reactive ion etching treatment by the Freon group gas is executed to the whole surface of an inter-layer insulating film 4 again, and executed until the inter-layer unsulating film in which the contact window section is thinned is removed completely. The end section of the contact window takes an adequately sloped shape 9 because the etching rate of the steeply rising section 8 of the upper section of the side surface of the contact window is faster than that of a flat section and the section 8 is removed selectively in second reactive ion etching. Al is applied and formed to shape an electrode wiring 5.
申请公布号 JPS6020535(A) 申请公布日期 1985.02.01
申请号 JP19830128374 申请日期 1983.07.13
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 OOKUMA TOORU;KANBARA GINJIROU
分类号 H01L21/302;H01L21/3065;H01L21/3205 主分类号 H01L21/302
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