| 摘要 |
PURPOSE:To decrease remarkably the capacity of terminal and also to quicken a circuit operation by inserting a buffer circuit near a bonding pad so as to eliminate the effect of the capacity of internal wiring. CONSTITUTION:An inverter circuit 7 is added just after each input protection circuit 5 connected respectively to bonding pads 4-1, 4-2, 4-3, 4-5, -, 4-9 for inputting each address signal respectively. The inverter circuit 7 has a depletion transistor (TR) Q3 and an enhancement TRQ4 and the depletion TRQ3 is used as a load TR. In impressing an address signal of a normal level to each bonding pad 4, no protection circuit 5 is activated, the address signal is inputted to an internal signal line 6 via the inverter circuit 7 an also transferred to an address buffer 3. The bonding pad 4 is not connected directly to the internal wiring 6 via the resistor R1 of the input protection circuit 5. |
