发明名称 Molded coil structure
摘要 An economical and light-weight molded coil structure wherein sheet-form electrical insulator layers containing a thermosetting resin are wrapped around the inner and outer peripheries of a coil to function as a casting mold, and end-enclosing resin layers are applied to the both end faces respectively of the coil not covered with the sheet-form insulator layers. A gas is charged to be sealed in the coil.
申请公布号 US4496926(A) 申请公布日期 1985.01.29
申请号 US19820370143 申请日期 1982.04.20
申请人 HITACHI, LTD. 发明人 KUBO, HIROFUMI;FUJIMORI, TOSHIYUKI
分类号 B29C67/00;B29C57/00;B29C70/06;H01F27/32;H01F41/12;(IPC1-7):H01F27/30 主分类号 B29C67/00
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