发明名称 |
Molded coil structure |
摘要 |
An economical and light-weight molded coil structure wherein sheet-form electrical insulator layers containing a thermosetting resin are wrapped around the inner and outer peripheries of a coil to function as a casting mold, and end-enclosing resin layers are applied to the both end faces respectively of the coil not covered with the sheet-form insulator layers. A gas is charged to be sealed in the coil.
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申请公布号 |
US4496926(A) |
申请公布日期 |
1985.01.29 |
申请号 |
US19820370143 |
申请日期 |
1982.04.20 |
申请人 |
HITACHI, LTD. |
发明人 |
KUBO, HIROFUMI;FUJIMORI, TOSHIYUKI |
分类号 |
B29C67/00;B29C57/00;B29C70/06;H01F27/32;H01F41/12;(IPC1-7):H01F27/30 |
主分类号 |
B29C67/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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