METHOD OF TREATING SURFACE OF COPPER PLATE

摘要

PURPOSE:To maintain the bonding of a copper plate for a long period of time, by providing a chelate compd. coating on one side of a copper plate to be bonded to an external plate of structure to be brought into contact with water and applying a phenolic resin primer on the coating. CONSTITUTION:In bonding a copper plate or a copper alloy plate 1 (hereinafter referred to as 'copper plate') to an external plate 6 of a structure to be brought into contact with water, a chelate compd. coating 3 is formed on one side of the copper plate 1 by a chelating treatment method. A phenolic resin primer is applied on the coating 3 form a coating 2. Separately, the external plate 6 is lined with a water-resistant resin to provide an insulating coating 5. The surface of the primer coating 2 of the surface-treated copper plate thus obtained is bonded to the external insulating coating 5 with an adhesive 4 such as acrylic resin.