| 摘要 |
PURPOSE:To obtain the titled semirigid or soft foam having high heat-resistance and useful as a high-temperature heat-insulation material, etc., by carrying out the foaming of the resin under compression at a restricted temperature using a specific foaming agent. CONSTITUTION:(A) poly-4-methyl-1-pentene (preferably having a melt-flow rate of 0.1-30g/10min under the load of 5kg at 260 deg.C and a melting point of <=235 deg.C) is mixed with (B) a foaming agent having a decomposition initiation temperature of higher than the softening point of the component A (e.g. azodicarbonamide), and the mixture is filled in a mold which can be subjected to the compression, heating and cooling, and pressed while keeping the temperature of the mold below the decomposition point of the foaming agent. The mold is heated above the melting point of the component A to decompose the foaming agent, cooled and opened when the mold temperature reaches (the crystallization temperature of the component A)+ or -10 deg.C, or the mold is cooled to a temperature lower than the crystallization temperature by >=10 deg.C, heated again, and opened when the mold temperature reaches (the melting point of the component A)-20 deg.C-(the melting point) to effect the foaming of the resin. |
