SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To improve the integration of the titled device without deteriorating the reliability thereof by a method wherein the edges of external leads are arranged under the inside from both sides of a package main body. CONSTITUTION:The external leads 4 drawn out of both sides of a resin sealing body 11 are bent almost rectangularly downward at the base of the body 11 and on the way bent inward and further bent downward to arrange the edges of the leads 4 under the inside from both sides of the package main body 11. At this time, conventional socket and printed-circuit board may be applicable and the width W of the package main body 11 is wider than that of conventional one since the edge interval L similar to that of conventional device is narrower than the width W of the package main body 11. Therefore, a larger pellet 13 may be fixed on the body 11 preventing any resin cracking from happening to improve the integration without deteriorating the reliability of the device.