发明名称 LEAD FRAME FOR IC
摘要 PURPOSE:To decrease surface treating costs and to shorten manufacturing processes, by performing thin plating of Ni to a hoop material made of Ni.Fe alloy, and applying very thin plating of one kind or alloy of Au, Ag and Pd immediately after the thin plating. CONSTITUTION:Alkali degreasing of a lead frame material is performed. Then chemical polishing is performed, and oxide and impurities on the surface are removed. Then the surface of the lead frame is activated by an electrolytic activation process. Thereafter, a negative current is conducted through the lead frame and a positive current is conducted through a nickel plate in plating bath, and the flash plating of Ni is performed. The negative current is conducted through the lead frame material and the positive current is conducted through a titanium platinum plated plate in the plating bath, and very thin plating of Au is performed.
申请公布号 JPS607157(A) 申请公布日期 1985.01.14
申请号 JP19830113659 申请日期 1983.06.25
申请人 KOBAYASHI MASAMI 发明人 KOBAYASHI MASAMI
分类号 H01L23/50;B23K35/00;C25D5/12;C25D5/34;H01L23/495 主分类号 H01L23/50
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