MULTIELEMENT THIN FILM HEAD

摘要

PURPOSE:To decrease resistance value and calorific value and to suppress the temp. elevation in an electromagnetic converting part by using one side of a pair of terminal lead-out wires as a common conductor layer. CONSTITUTION:Copper having excellent concductivity and heat conductivity is formed uniformly to a film thickness of 1 micron by a sputtering means as a common conductor layer 8 on a magnetic base plate 1. Alumina as an insulating layer 2 is stuck to and formed on the layer 8 by a sputtering means in order to form a magnetic gap 2a. Copper is formed uniformly thereon to a thickness of several microns by a sputtering means as a conductor layer 3 for winding and is thereafter formed to a desired shape by using a photolithographic technique. A photoresist is then formed thereon as an insulating layer 4 to a prescribed shape by using a photolithographic technique. ''Permalloy '' is laminated thereon as an upper magnetic material layer 5 to a film thickness of several microns by a sputtering means and is formed to a required track width by a photolithographic technique.