| 摘要 |
PURPOSE:To enable to find dust, stain etc. at the same time with positioning of the semiconductor chip of a solid-state image pick-up device. CONSTITUTION:A semiconductor chip 12 held by a vacuum attractingly holding means is put on solder bumps 11 in the recessed part 7a of a package 7 positioned to be fixed on a pair of loading bases 18 as to make the electrodes 12a thereof to come in contact with the solder bumps 11. Then the semiconductor chip 12 is made to act according to a driving circuit 16 through lead wires provided to the package 7 to project the picked picture of the semiconductor chip 12 on the CRT picture of a display device 15. the semiconductor chip 12 loaded on the solder bumps 11 is moved as to make the images 26 of marks projected on the CRT picture to coincide with the reference marks 15a. At this time, when dust, s stain, etc. exist on the image picture of the semiconductor chip 12, because dust, stain, etc. thereof are projected on the CRT picture of the display device 15, the semiconductor chip 12 is exchanged at this time. |
