| 发明名称 |
Board, in particular thermal insulating board, and process as well as means for production thereof |
| 摘要 |
A board based on rigid and tough foam plastics is provided with voids disposed at parallel distances from one another, which voids permit an elastic compression transversely to their extent. |
| 申请公布号 |
DE3319700(A1) |
申请公布日期 |
1984.12.06 |
| 申请号 |
DE19833319700 |
申请日期 |
1983.05.31 |
| 申请人 |
EBNER,WALTER |
发明人 |
EBNER,WALTER |
| 分类号 |
B29C33/00;B29C33/50;B29C44/38;B29C44/56;E04B1/80;E04D13/16 |
主分类号 |
B29C33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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