| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which imparts good package appearances particularly to a thin package, and an electronic part device equipped with an element sealed with the same. SOLUTION: The epoxy resin molding material for sealing comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent, (C) at least one of an oxidized polymer or an oxidized copolymer of at least one of ethylene and propylene having a weight-average molecular weight of at least 4,000 and a penetration of larger than 2, and (D) a compound obtained by esterifying a copolymer of a 5-30Cα-olefin and maleic anhydride with a 5-25C monohydric alcohol. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing. COPYRIGHT: (C)2005,JPO&NCIPI
|
