| 摘要 |
PURPOSE:To facilitate the alignment of a wafer whose scribeline can not be detected by adopting a pattern detection method and a point-to-point coincidence method. CONSTITUTION:After a center point 22 of a pellet image 21 predetermined in a recognition equipment and the center point 24 of a pellet image 23 which is the nearest to the center point 22 are detected by the recognition equipment, an X-Y stage is driven until those two center points coincide. The pellet image 21 is moved to the position where it coincides a pellet 25 to be measured by moving the X-Y stage to the -X direction by the distance X. When the pellet image 21 is moved, the magnitude X of the movement is detected and a center point IIIof the pellet 25 to be measured is obtained taking the first center point I of the pellet image 21 as the origin. The X components and the Y components of vectors I and III are obtained from the detection results of the recognition equipment and the inclination angle theta against the X-axis is obtained by using those X and Y components. The table is rotated in accordance with the value of theta. |
