| 摘要 |
A nitride-coated boat is used in a method for depositing phosphosilicate glass (PSG) on semiconductor wafers. Because stainless steel is the material typically used for the boat for PSG deposition, the linear coefficient of thermal expansion of the boat is significantly greater than that of PSG. Consequently, cooling the boat after PSG deposition tends to cause flaking of PSG from the boat. The nitride-coating on the boat buffers the contraction differential between the PSG and stainless steel to significantly reduce flaking of PSG.
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