| 摘要 |
PURPOSE:To largely improve the tensile strength and the bending stress of a pin for external leads by forming a reinforcing layer for preventing the periphery for surrounding the conductive mount of the pin and a conductor layer of an enclosure structure base from adherence of a solder. CONSTITUTION:A conductive layer 5 is formed on the back surface of an alumina ceramic base 1, an alumina sheet 9 is bonded to cover the periphery, seized, and a solder pad zone of the periphery of the layer 5 is narrowed. The head of a pin 2 is press-bonded through a silver solder 6 on the exposed part of the layer 5, and a nickel plating layer 7 is formed. It is dipped in a solder path, thereby providing a solder layer 10 on the pin 2 and the layer 5. The swell of the layer 10 is small due to the presence of a reinforcing layer 9, bonded with a thin layer, and the strength is hardly deteriorated. The operation of concentrating the stress at the mount can be largely moderated, thereby improving the reliability for the temperature cycle. |
