| 摘要 |
PURPOSE:To easily form a multipin wiring on the titled semiconductor device as well as to unnecessitate wire bonding by a method wherein a semiconductor pellet is adhered to the recessed part provided on the base of a package, an external lead-out wiring terminal is formed on the base surrounding the semiconductor pellet, and when the above is connected by a wiring layer through the intermediary of the hole provided on the insulating material covering the whole surface, said wiring layer is formed into the surface condition wherein a microscopic processing is performed. CONSTITUTION:A recessed part is provided in the center part of the surface of the package 1, a semiconductor pellet is adhered therein, and an external lead- out wiring terminal 2 is coated on the region ranging from the surface to the side face of the package 1 surrounding the pellet 3. Then, an insulating material 4 is covered on the pellet 3 and the terminal 2 which is located on the surface of the pellet 3, a hole 5 is provided and the pellet 3 and the surface of the terminal 2 are connected using a wiring layer 6. According to this constitution, the wiring layer 6 has a microscopically processed surface, and a wire bonding process or a chip bonding process and the like is unnecessitated, thereby enabling to perform a multipin wiring with least wiring manhours. |
