发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To provide high sensitivity and high printing resistance by blending a diazo compound with a composition consisting essentially of an acrylic copolymer contg. polybutadiene, a cross-linking agent and a photopolymn. initiator. CONSTITUTION:This photosensitive resin composition is obtd. by blending a diazo compound with a composition consisting essentially of a multicomponent type copolymer, a cross-linking agent and a photopolymn. initiator. The copolymer has >=20,000mol.wt. and consists of 0.1-5wt% polybutadiene, 5-70wt% alkyl acrylate or alkyl methacrylate, 20-70wt% unsatd. carboxylic acid and 5-60wt% styrene or alkylstyrene as constituent units. The total amount of the copolymer, the cross-linking agent and the initiator is 5-50wt% of the amount of the diazo compound. When the photosensitive resin composition is used, a tough and flexible image is formed, and an offset printing plate with high sensitivity and high printing resistance can be manufactured.
申请公布号 JPS59206825(A) 申请公布日期 1984.11.22
申请号 JP19830082404 申请日期 1983.05.10
申请人 NIHON SEIHAKU KK 发明人 YOKOTA YUUZOU;KITAMURA HIRONORI;KIMURA KEIICHI
分类号 G03F7/021;G03F7/016 主分类号 G03F7/021
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