| 摘要 |
PURPOSE:To contrive the accurate positioning of semiconductor chip and the improvement of adhesive strength of bonding with Al wire by forming Al layers on a wire bonding part and the part surrounding a chip fitting part on a metal frame. CONSTITUTION:The Al layers 10 are formed by adhesion on the wire bonding part and the part surrounding the chip fitting part on the metal frame 2 respectively. Next, solder printing is performed for a metallizing part of the insulating substrate 1 and the chip fitting part of the frame 2. Subsequently, the frame 2 is put on the predetermined position of the substrate 1 and is fixed and held to that. Also a semiconductor chip 4 is put on the chip fitting part on the frame 2 and these are heated to be soldered unitarily. After that, the chip 4 and the layer 10 are wire-bonded with Al wire 11. In this manufacturing method, positioning of the chip 4 is achieved by the layer 10 so that the chip 4 is not soldered because of being inclined. Also as the bonding connection part becomes an Al layer, the adhesive strength can be improved. |
