发明名称 VAPOR PHASE SOLDERING DEVICE
摘要 PURPOSE:To remove with separation an excess solder and to form a uniform solder film on a soldering body by providing freely rotatably the carrier containing the soldering body on a conveyor, by transferring to a vapor chamber after dipping in a solder tank and by rotating at high speed by a freely attach able and detackable rotation driving part. CONSTITUTION:The evaporated latent heat of a saturated vapor phase 14 heats upto a reflowing temp. an individual soldering body inside a carrier 31 when the carrier 31 is transferred inside a vapor chamber 12 from an inlet port 41 by a conveyor 5 and the sticking solder in the solder tank 73 at prestage is melted. The rotation driving part 62 of a rotary actuator 61 is then descended for the carrier 31a which stopped at the lowest position of downward movement and engaged with the engaging part 53 of the carrier 31a. The engaging part 53 is then driven with its rotation and the carrier 31a is rotated at high speed via a rotary shaft 52. A centrifugal force is therefore acted on the re-melted solder adhered on numerous soldering bodies inside the carrier 31a.
申请公布号 JPS6213265(A) 申请公布日期 1987.01.22
申请号 JP19850150951 申请日期 1985.07.09
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MASUDA TSUGUNORI;ABE NOBUHIDE;TAKAHASHI TAKAO;OKANO TERUO
分类号 B23K1/015;H05K3/34 主分类号 B23K1/015
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