| 摘要 |
<p>PURPOSE:To inspect the connection state of electronic components to a printed circuit board at a high accuracy by irradiating a lead of electronic components with an energy beam to detect infrared rays radiated from a conductor pattern. CONSTITUTION:A part 5 of a lead 4 of electronic components 6 carried on substrate 1 is irradiated with an energy beam 7 such as laser beam to observe changes in the time of an infrared rays 8 radiated from a pattern 2. When the connection is normal, as the quantity of heat applied is consumed to raise the temperature of a solder 3, the rising of the infrared rays 8 is slow with time while when it is defective, that is quick because of a quick heat conduction to the pattern 2. Thus, the connection state of electronic components 6 to the substrate 1 can be inspected at a high accuracy.</p> |
