发明名称 Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
摘要 Electronic components are encapsulated with a calcium silicate-containing poly(arylene sulfide) composition. The composition can also contain a filler such as talc or silica and an organosilane such as 3-mercaptopropyltrimethoxysilane.
申请公布号 US4482665(A) 申请公布日期 1984.11.13
申请号 US19820417949 申请日期 1982.09.14
申请人 PHILLIPS PETROLEUM COMPANY 发明人 DIX, JAMES S.
分类号 H01C1/02;C08K3/34;C08K5/54;C08K7/10;C08L81/00;H01B3/30;H01C1/034;H01G2/12;H01L23/29;H05K5/06;(IPC1-7):C08K5/54 主分类号 H01C1/02
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