| 摘要 |
PURPOSE:To prevent wafers from being damaged and reacting by processing chemical solution to be provided with the strength required for supplying, containing and storing themselves by a method wherein core materials made of rigid body is buried in a box unit injection-molded by copolymer resin of tetrafluoroethylene and perfluoroalcoxyethylene. CONSTITUTION:A pair of side walls 2, 2 facing to each other are provided to be connected forming into one body by connecting rods 3 while on the inner surface of the side walls 2, gooves 4 are extendedly provided in the longitudinal direction corresponding to the numbers of semiconductor wafers 1 to be contained and each groove 4 is provided by means of protruding groove walls 9. The side walls 2 are made of copolymer resin of tetrafluoroethylene and perfluoroalcoxyethylene while core materials 5 are buried inside a flat part 10 and the groove walls 9 connected with each other. The core materials 5 may be made of almost all kind of metals such as aluminum, statinless steel, aluminum alloy and titanium etc. Besides the core materials 5 may be provided with multiple perforations at specified intervals to improve the adhesion with resin making itself lightweighted. |
