| 摘要 |
<p>PURPOSE:To enable to easily check the failure of a signal wiring layer and repair said layer by a method wherein the titled substrate is put in a structure wherein a repair wiring layer is formed in the inner layer. CONSTITUTION:A multiple signal wiring layer 43 is formed on the surface of a multilayer ceramic substrate 42, and signal terminal pins 41A exist on the back surface of the substrate, which pins 41A are electrically connected to the front side of the substrate via through holes 42A. A repair layer 44 is formed on said wiring layer 43, and a surface connection layer 45 is formed thereon. In the case of failure in the signal wiring layer, e.g., the short-circuit of a signal line at the part 47, a repair wiring conductor 44A is cut at four points of 44A1- 44A4, and accordingly the original surface connection terminal 45 is connected to said pins 44A by re-wiring repair patterns 44A5 and 44A6. Even when there is failure at any point of a multilayer signal wiring pattern in such a manner, said pattern is formed by utilizing the repair wiring layer.</p> |
