| 摘要 |
PURPOSE:To enable a flash to be accurately and surely removed, by providing flash removing scrapers of thin plate shape protruded from a rotary unit, in the case of a flash removing device for a resin mold type semiconductor device or the like. CONSTITUTION:Turning a rotary shaft 8 by a motor 9 through a belt 10, if a semiconductor device 1 is moved so that scrapers 6 of resilient thin plate material, consisting of spring steel or the like and fixedly provided on a boss 5, bring their end in contact with a flash 4 on a lead frame 3 of the resin mold type semiconductor device 1, the flash 4 is scraped off and removed by the end of the scrapers 6. Here the scraper 6 is not curved in the axial direction but resiliently curved in the rotary direction of the boss 5, and only a position necessary to remove the flash can be accurately brushed. While the end of each scraper 6, being formed in a mutual stagger tapered shape, enables the flash to be surely removed even if the lead frame 3 is provided with a rugged surface. |
