| 摘要 |
PURPOSE:To improve the humidity resistance as well as to contrive the reduction of the cost by performing the fixation of the semiconductor chip to the lead frame consisting of copper or alloy of copper and the wire bonding in the reducing atmosphere and by performing the resin molding with considering restraint of oxidation of the surface of the lead frame. CONSTITUTION:The lead frame for this use is one that is not gilded with gold or silver. The fixing of the chip to the upper surface of said lead frame and the wire bonding are attained in a reducing atmosphere, e.g. made by a foaming gas. The chip 3 is stuck to an upper surface of the lead frame 2 through a wax layer 7 and for the wire bonding, e.g. a gold wire is thermally stuck to the upper surface of the lead frame 2 directly. Next, the resin molding is performed. As the lead terminals are in a state in which only a natural oxide film is produced, tight contact of the lead terminals and the mold resin is strong and this strength further improves by the further post-heating. |
